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Cheongju-si, South Korea

Nepes Co., Ltd.

USPTO Granted Patents = 26

EPO Patents = 1

Forward Citations = 57

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58 inventors (with patents filed for the assignee):

Yong Tae Kwon (8 out of 9 patents)

Dong Hoon Oh (6 out of 7 patents)

Jun-Kyu Lee (6 out of 6 patents)

4. Jun Kyu Lee (5 out of 6 patents)

5. Yong-Tae Kwon (5 out of 6 patents)

6. Su Yun Kim (4 out of 4 patents)

7. Yong Woon Yeo (3 out of 3 patents)

8. Eung Ju Lee (2 out of 3 patents)

9. Ju Hyun Nam (2 out of 2 patents)

10. Dong-Hoon Oh (2 out of 2 patents)

11. Tae-Won Kim (2 out of 2 patents)

12. Hee Cheol Kim (2 out of 4 patents)

13. Byung Cheol Kim (2 out of 2 patents)

14. Hyo Gi Jo (2 out of 2 patents)

15. Jae Cheon Lee (2 out of 3 patents)

26 patents: Sort by Forward Citations

1. 12494421 - Semiconductor package including redistribution structure, and method of manufacturing the same (2025-12-09),

2. 12205904 - Wafer-level design and wiring pattern for a semiconductor package (2025-01-21),

3. 12198997 - Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients (2025-01-14),

4. 12183704 - Semiconductor package and method for manufacturing the same (2024-12-31),

5. 12125775 - Semiconductor package and method for manufacturing the same (2024-10-22),

6. 11948891 - Semiconductor package and manufacturing method thereof (2024-04-02),

7. 11545451 - Semiconductor package (2023-01-03),

8. 11476211 - Semiconductor package and manufacturing method thereof (2022-10-18),

9. 11450535 - Manufacturing method for semiconductor package including filling member and membrane member (2022-09-20),

10. 11404347 - Semiconductor package (2022-08-02),

11. 11393768 - Semiconductor package and manufacturing method thereof (2022-07-19),

12. 11276632 - Semiconductor package (2022-03-15),

13. 11264330 - Chip package with connection portion that passes through an encapsulation portion (2022-03-01),

14. 11011502 - Semiconductor package (2021-05-18),

15. 10964656 - Semiconductor package and method of manufacturing same (2021-03-30),

Nepes Co., Ltd. is a South Korean company specializing in semiconductor packaging solutions including flip chip and wafer-level packaging. With a history dating back to 1990, Nepes has established itself as a leader in the industry, providing cutting-edge technologies and innovative solutions to meet the evolving needs of the semiconductor market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

26 Patents

#5 in Cheongju-si

#497 in South Korea

#24,093 in the World

Cheongju-si, South Korea

Nepes Co., Ltd.

Forward Citations = 57

58 inventors:

Yong Tae Kwon (8 out of 9 patents)

Dong Hoon Oh (6 out of 7 patents)

Jun-Kyu Lee (6 out of 6 patents)

4. Jun Kyu Lee (5 out of 6 patents)

5. Yong-Tae Kwon (5 out of 6 patents)

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