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For the Inventor, By the Inventor

Cheongju, South Korea

Nepes Co., Ltd.


USPTO Granted Patents = 27

% Expired Patents = 7.4


Forward Citations = 65

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58 inventors (with patents filed for the assignee):

goldMedal Yong Tae Kwon (9 out of 10 patents)

silverMedal Dong Hoon Oh (7 out of 8 patents)

bronzeMedal Jun Kyu Lee (6 out of 7 patents)

4.  Jun-Kyu Lee (6 out of 6 patents)

5.  Su Yun Kim (5 out of 5 patents)

6.  Yong-Tae Kwon (5 out of 6 patents)

7.  Yong Woon Yeo (3 out of 3 patents)

8.  Ju Hyun Nam (3 out of 3 patents)

9.  Eung Ju Lee (2 out of 3 patents)

10.  Dong-Hoon Oh (2 out of 2 patents)

11.  Tae-Won Kim (2 out of 2 patents)

12.  Hee Cheol Kim (2 out of 4 patents)

13.  Byung Cheol Kim (2 out of 2 patents)

14.  Hyo Gi Jo (2 out of 2 patents)

15.  Jae Cheon Lee (2 out of 3 patents)


Core Competencies:
Semiconductor Package
Manufacturing Method
Redistribution Structure
Thermal Expansion Coefficients
Wafer-Level Design
Stacked Semiconductor Package
Chip Package
Image Sensor
Nanosize Dispersed Pigments
Encapsulation Portion
Filling Member
Membrane Member

27 patents:

1. 12525547 - Semiconductor package and method for manufacturing same (2026-01-13),
2. 12494421 - Semiconductor package including redistribution structure, and method of manufacturing the same (2025-12-09),
3. 12205904 - Wafer-level design and wiring pattern for a semiconductor package (2025-01-21),
4. 12198997 - Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients (2025-01-14),
5. 12183704 - Semiconductor package and method for manufacturing the same (2024-12-31),
6. 12125775 - Semiconductor package and method for manufacturing the same (2024-10-22),
7. 11948891 - Semiconductor package and manufacturing method thereof (2024-04-02),
8. 11545451 - Semiconductor package (2023-01-03),
9. 11476211 - Semiconductor package and manufacturing method thereof (2022-10-18),
10. 11450535 - Manufacturing method for semiconductor package including filling member and membrane member (2022-09-20),
11. 11404347 - Semiconductor package (2022-08-02),
12. 11393768 - Semiconductor package and manufacturing method thereof (2022-07-19),
13. 11276632 - Semiconductor package (2022-03-15),
14. 11264330 - Chip package with connection portion that passes through an encapsulation portion (2022-03-01),
15. 11011502 - Semiconductor package (2021-05-18),
Company Overview
Nepes Co., Ltd. is a South Korean company headquartered in Cheongju, specializing in advanced materials and semiconductor packaging solutions. The organization focuses on developing innovative technologies that enhance the performance and reliability of electronic devices. With a strong emphasis on research and development, Nepes is involved in various sectors, including electronics, automotive, and renewable energy, contributing to the advancement of high-tech industries both locally and globally.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

27 Patents

#6 in Cheongju

#501 in South Korea

#24,012 in the World

Cheongju, KR
Cheongju, South Korea

Nepes Co., Ltd.

Forward Citations = 65

58 inventors:

goldMedal Yong Tae Kwon (9 out of 10 patents)

silverMedal Dong Hoon Oh (7 out of 8 patents)

bronzeMedal Jun Kyu Lee (6 out of 7 patents)

4.  Jun-Kyu Lee (6 out of 6 patents)

5.  Su Yun Kim (5 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nepes Co., Ltd.. Retrieved from https://idiyas.com/company/nepes-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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