The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Nov. 13, 2020
Nepes Co., Ltd., Eumseong-gun, KR;
Nam Chul Kim, Cheongju, KR;
Jong Heon Kim, Seongnam, KR;
Eung Ju Lee, Cheongju, KR;
Yong Woon Yeo, Cheongju, KR;
Chang Woo Lee, Seoul, KR;
NEPES CO., LTD., Chungcheongbuk-Do, KR;
Abstract
A semiconductor package according to an exemplary embodiment of the present disclosure may comprise a semiconductor chip comprising a chip pad; a redistribution layer electrically connected to the chip pad of the semiconductor chip; an external connection terminal electrically connected to the redistribution layer; a sealing material covering the semiconductor chip and configured to fix the semiconductor chip and the redistribution layer; an adhesive film positioned on the upper surface of the sealing material; and a heat sink formed on the upper surface of the adhesive film and having a stepped portion at the periphery thereof.