Location History:
- Chungcheongbuk-do, KR (2012)
- Cheongju, KR (2022)
- Cheongju-si, KR (2022)
Company Filing History:
Years Active: 2012-2022
Title: Eung Ju Lee: Innovator in Semiconductor Packaging
Introduction
Eung Ju Lee is a prominent inventor based in Cheongju, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of three patents. His innovative designs focus on improving the durability and manufacturing processes of semiconductor packages.
Latest Patents
One of his latest patents involves a semiconductor package that includes a semiconductor chip with a chip pad, a redistribution layer, and an external connection terminal. This design features a sealing material that secures the semiconductor chip and redistribution layer, along with an adhesive film and a heat sink. Another notable patent is for a chip package that enhances package strength and simplifies the manufacturing process. This invention integrates a reinforcing layer on the chip using an adhesive layer, improving the overall durability of the package.
Career Highlights
Eung Ju Lee has worked with notable companies such as Nepes Co., Ltd. and Nepes Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations
He has collaborated with talented individuals in the field, including Yun Mook Park and Jun Kyu Lee. These partnerships have contributed to the advancement of his projects and patents.
Conclusion
Eung Ju Lee's work in semiconductor packaging showcases his dedication to innovation and improvement in technology. His patents reflect a commitment to enhancing the durability and efficiency of semiconductor products.