For the Inventor, By the Inventor

Enter assignee name

Chungcheonbuk-do, South Korea

Nepes Corporation

USPTO Granted Patents = 11

Forward Citations = 96

Loading Chart...

Loading Chart...

21 inventors (with patents filed for the assignee):

Yun Mook Park (4 out of 5 patents)

In Soo Kang (4 out of 4 patents)

Gi Jo Jung (2 out of 3 patents)

4. Gi-Jo Jung (2 out of 2 patents)

5. Jung Won Lee (2 out of 2 patents)

6. Jong Heon Kim (1 out of 2 patents)

7. Eung Ju Lee (1 out of 3 patents)

8. Xudong Chen (1 out of 11 patents)

9. Jun Kyu Lee (1 out of 7 patents)

10. Yong-Tae Kwon (1 out of 6 patents)

11. Byoung Yool Jeon (1 out of 1 patent)

12. Chi Jung Song (1 out of 1 patent)

13. In-Soo Kang (1 out of 1 patent)

14. Byung-Jin Park (1 out of 1 patent)

15. Seung Dae Baek (1 out of 1 patent)

11 patents: Sort by Forward Citations

1. 12614850 - Semiconductor package including antenna and method of manufacturing the semiconductor package (2026-04-28),

2. 11674047 - Composition for manufacturing passivation layer and passivation layer using the same (2023-06-13),

3. 9006872 - Semiconductor chip package having via hole and semiconductor module thereof (2015-04-14),

4. 8421211 - Wafer level semiconductor package and fabrication method thereof (2013-04-16),

5. 8237276 - Bump structure and fabrication method thereof (2012-08-07),

6. 8093721 - Flip chip semiconductor package and fabrication method thereof (2012-01-10),

7. 7977789 - Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same (2011-07-12),

8. 7952210 - Semiconductor package and fabrication method thereof (2011-05-31),

9. 7919833 - Semiconductor package having a crack-propagation preventing unit (2011-04-05),

10. 7906842 - Wafer level system in package and fabrication method thereof (2011-03-15),

11. 7808095 - Ultra slim semiconductor package and method of fabricating the same (2010-10-05),

Nepes Corporation is a leading provider of advanced microelectronics and system integration solutions. With a focus on semiconductor packaging and interconnect technology, Nepes has established itself as a reliable partner for various industries including automotive, consumer electronics, and telecommunications. With an emphasis on innovation and quality, Nepes offers a wide range of products and services to meet the evolving needs of its customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

Nepes Corporation

11 Patents

#2 in Chungcheonbuk-do

#1,012 in South Korea

#51,610 in the World

Chungcheonbuk-do, South Korea

Nepes Corporation

Forward Citations = 96

21 inventors:

Yun Mook Park (4 out of 5 patents)

In Soo Kang (4 out of 4 patents)

Gi Jo Jung (2 out of 3 patents)

4. Gi-Jo Jung (2 out of 2 patents)

5. Jung Won Lee (2 out of 2 patents)

Please report any incorrect information to [email protected]

Loading…