The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Jun. 27, 2010
Applicants:
IN Soo Kang, Chungcheongbuk-do, KR;
Gi JO Jung, Chungcheongbuk-do, KR;
Byoung Yool Jeon, Chungcheongbuk-do, KR;
Inventors:
In Soo Kang, Chungcheongbuk-do, KR;
Gi Jo Jung, Chungcheongbuk-do, KR;
Byoung Yool Jeon, Chungcheongbuk-do, KR;
Assignee:
Nepes Corporation, , KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 25/065 (2006.01); H01L 23/562 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer level semiconductor package is provided. A warpage control barrier line formed in every package of a single wafer prevents wafer from warping. The changed shape of the interface between a semiconductor chip and a molding layer at the edge of the package disperses stress applied to the outside of the package, and suppress the generation and propagation of crack. The size of the package is reduced to that of the semiconductor, and the thickness of the package is minimized.