Chungcheongbuk-do, South Korea

Byoung Yool Jeon


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: The Innovations of Byoung Yool Jeon: A Pioneer in Semiconductor Packaging

Introduction: Byoung Yool Jeon, a prominent inventor based in Chungcheongbuk-do, South Korea, has made significant contributions to the field of semiconductor technology. With a focus on enhancing the reliability and efficiency of semiconductor packaging, his innovative work is shaping the future of electronic devices.

Latest Patents: Jeon holds a patent for a groundbreaking invention titled "Wafer Level Semiconductor Package and Fabrication Method Thereof." This innovative semiconductor package features a warpage control barrier line designed to maintain the integrity of the wafer during production. The unique design disperses stress at the interface between the semiconductor chip and the molding layer, ultimately reducing the risk of cracks. Not only does this invention minimize the size of the package to match the dimensions of the semiconductor itself, but it also reduces the overall thickness, making it a remarkable advancement in semiconductor packaging techniques.

Career Highlights: Byoung Yool Jeon is affiliated with Nepes Corporation, a company known for its cutting-edge research and development in semiconductor solutions. His work at Nepes emphasizes practical applications and innovation in semiconductor packaging, contributing to the company's reputation as a leader in the industry.

Collaborations: Throughout his career, Jeon has collaborated with talented individuals, including his coworkers In Soo Kang and Gi Jo Jung. These partnerships foster creativity and contribute to the development of groundbreaking technologies in the semiconductor sector.

Conclusion: Byoung Yool Jeon stands out as an influential inventor in the field of semiconductor packaging. His patented innovations not only enhance the reliability of electronic devices but also pave the way for advancements in the technology sector. As he continues to push the boundaries of innovation at Nepes Corporation, the impacts of his work will undoubtedly resonate throughout the industry for years to come.

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