Seung Dae Baek

Title: Seung Dae Baek: Semiconductor Packaging Innovation

Introduction

Seung Dae Baek is an inventor based in Cheongju, South Korea, associated with Nepes Corporation. His work includes an invention focused on semiconductor packaging and its fabrication.

Latest Patents

Baek is named on 1 patent: “Semiconductor Package and Fabrication Method Thereof.” The invention describes a package built around a multilayer thin-film structure containing dielectric layers and redistribution layers. A semiconductor chip is electrically connected to the redistribution layer on one side, while a solder bump is formed on the other.

The thin-film structure serves as the package substrate, enabling a compact ball grid array (BGA) package without an additional substrate. The design also supports simultaneous package formation at wafer or carrier level, which can simplify manufacturing and support mass production. Tested chips with favorable operating characteristics can be selectively bonded to the structure, helping reduce defective products. The patent describes potential applications in communication devices, displays, and other electronic products.

Career Highlights

Baek’s listed patent highlights an approach to making semiconductor packages lighter, thinner, and more compact while streamlining fabrication. His work is associated with Nepes Corporation.

Collaborations

Jong Heon Kim and Gi-Jo Jung are identified as Baek’s coworkers.

Conclusion

Seung Dae Baek’s semiconductor packaging invention combines a substrate-free multilayer structure with wafer-level manufacturing possibilities, aiming to support compact electronic devices and efficient production.