Location History:
- Chungcheongbuk-do, KR (2012)
- Cheongju-Si, KR (2011 - 2022)
Company Filing History:
Years Active: 2011-2022
Title: Inventor Spotlight: Yun Mook Park
Introduction: Yun Mook Park is a renowned inventor based in Cheongju-si, South Korea, recognized for his significant contributions to semiconductor packaging technology. With a robust portfolio of five patents, Park has demonstrated a commitment to enhancing the durability and efficiency of chip packages through innovative designs and manufacturing processes.
Latest Patents: Among his latest patents, Park has developed a chip package with a connection portion that passes through an encapsulation portion. This invention aims to improve package strength and streamline manufacturing processes. By incorporating a reinforcing layer on a chip with an adhesive layer and integrating these using a molding layer, the durability of the package is enhanced. Additionally, his patent outlines a structural innovation with solder balls formed between a base substrate and a re-wiring layer, integrated with the molding layer. Another notable patent is the bump structure and fabrication method for semiconductor devices, featuring a metal post connected to an electrode pad, which allows for a fine pitch semiconductor package while minimizing the risk of shorts between neighboring bumps.
Career Highlights: Throughout his career, Yun Mook Park has worked with esteemed companies such as Nepes Corporation and Nepes Co., Ltd., where he has honed his expertise in semiconductor technology and packaging solutions. His practical experience in these organizations has undoubtedly contributed to his innovation in the field.
Collaborations: Park has collaborated with notable colleagues, including Eung Ju Lee and Jun Kyu Lee, to further drive advancements in semiconductor packaging technology. These collaborations have allowed for a rich exchange of ideas and expertise, enhancing the innovative capacity within their projects.
Conclusion: Yun Mook Park exemplifies the spirit of innovation in the realm of semiconductor technology. His patents not only reflect his technical proficiency but also address crucial challenges in the industry, paving the way for more robust and efficient electronic devices. Through his continuous efforts, Park is making significant strides that will influence the future of semiconductor packaging.