Location History:
- Cheongju, KR (2022)
- Cheongju-si, KR (2022)
Company Filing History:
Years Active: 2022-2025
Title: Yong Woon Yeo: Innovator in Semiconductor Packaging
Introduction
Yong Woon Yeo is a prominent inventor based in Cheongju, South Korea, known for his significant contributions to the field of semiconductor technology. With three patents to his name, Yeo is at the forefront of innovation, particularly in the design and implementation of semiconductor packages.
Latest Patents
Yeo's latest patents reflect his expertise and creativity in semiconductor packaging. One of his notable patents is for a semiconductor package that includes a first molding layer and a second molding layer with different thermal expansion coefficients. This innovative design encapsulates a semiconductor chip, integrates a conductive post, and features a redistribution structure designed for enhanced electrical connectivity.
Another important patent pertains to a semiconductor package that mainly comprises a semiconductor chip with a chip pad, a redistribution layer connected to the chip pad, and an external connection terminal. This design meticulously addresses the sealing of the semiconductor chip with a sealing material while incorporating a heat sink, ensuring optimal performance and reliability.
Career Highlights
Yeo's career at Nepes Co., Ltd. has been marked by his dedication to advancing semiconductor technology. His innovative spirit and technical acuity have greatly influenced the company's direction and contributed to its reputation in the electronics industry.
Collaborations
Throughout his career, Yong Woon Yeo has collaborated with prominent colleagues, including Eung Ju Lee and Jun Kyu Lee. Their synergy in research and development has led to significant advancements in semiconductor packaging solutions, fostering a dynamic environment of creativity and innovation.
Conclusion
Yong Woon Yeo's contributions to the field of semiconductor technology illustrate the profound impact of inventive thinking on the industry. His continuous work at Nepes Co., Ltd. and his innovative patents exemplify a commitment to enhancing the performance and reliability of semiconductor packages, setting a standard for future advancements in the field.