The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2024
Filed:
Nov. 11, 2021
Nepes Co., Ltd., Chungcheongbuk-do, KR;
Nepes Laweh Corporation, Chungcheongbuk-do, KR;
Byung Cheol Kim, Incheon, KR;
Yong Tae Kwon, Chungcheongbuk-do, KR;
Hyo Gi Jo, Chungcheongbuk-do, KR;
Dong Hoon Oh, Chungcheongbuk-do, KR;
Jae Cheon Lee, Chungcheongbuk-do, KR;
Hyung Jin Shin, Chungcheongbuk-do, KR;
Mary Maye Melgo Galimba, Cavite, PH;
NEPES CO., LTD., Chungcheongbuk-do, KR;
NEPES LAWEH CORPORATION, Chungcheongbuk-do, KR;
Abstract
Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.