For the Inventor, By the Inventor

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Nepes Laweh Corporation

USPTO Granted Patents = 4

Forward Citations = 2

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14 inventors (with patents filed for the assignee):

Yong Tae Kwon (3 out of 9 patents)

Dong Hoon Oh (2 out of 7 patents)

Byung Cheol Kim (2 out of 2 patents)

4. Hyo Gi Jo (2 out of 2 patents)

5. Jae Cheon Lee (2 out of 3 patents)

6. Hyung Jin Shin (2 out of 2 patents)

7. Mary Maye Melgo Galimba (2 out of 2 patents)

8. Yongtae Kwon (1 out of 2 patents)

9. Junkyu Lee (1 out of 1 patent)

10. Jaecheon Lee (1 out of 2 patents)

11. Mina Yoon (1 out of 1 patent)

12. Nam Chul Kim (1 out of 1 patent)

13. Yong Woon Yeo (1 out of 1 patent)

14. Young Seok Lee (1 out of 2 patents)

4 patents: Sort by Forward Citations

1. 12183704 - Semiconductor package and method for manufacturing the same (2024-12-31),

2. 12125775 - Semiconductor package and method for manufacturing the same (2024-10-22),

3. 11062990 - Semiconductor package of using insulating frame (2021-07-13),

4. 10804146 - Method for producing semiconductor package (2020-10-13),

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USPTO Data Jan 1 1976 - Jan 6 2026

4 Patents

#320 in

#1,118 in

Nepes Laweh Corporation

Forward Citations = 2

14 inventors:

Yong Tae Kwon (3 out of 9 patents)

Dong Hoon Oh (2 out of 7 patents)

Byung Cheol Kim (2 out of 2 patents)

4. Hyo Gi Jo (2 out of 2 patents)

5. Jae Cheon Lee (2 out of 3 patents)

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