The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Jul. 15, 2022
Nepes Laweh Corporation, Cheongju-si, KR;
Nepes Hayyim, Blnan, PH;
Jerry Lutiva Tan, Batangas, PH;
NEPES LAWEH CORPORATION, Cheongju-si, KR;
NEPES HAYYIM, Binan, PH;
Abstract
According to one or more embodiments, a semiconductor package includes: a first semiconductor chip including an upper surface, a lower surface, and a side surface and including a chip pad provided on the upper surface; a first cover insulating layer covering the upper surface and the side surface of the first semiconductor chip; a first upper conductive layer extending along an upper surface of the first cover insulating layer and connected to the chip pad of the first semiconductor chip; a first side conductive layer extending along a side surface of the first cover insulating layer and connected to the first upper conductive layer; a second cover insulating layer covering the first upper conductive layer, the first side conductive layer, and the first cover insulating layer; and a first lower conductive layer extending along the lower surface of the first semiconductor chip and connected to the first side conductive layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile