The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Jul. 09, 2019
Applicant:
Nepes Co., Ltd., Chungcheongbuk-do, KR;
Inventors:
Nam Chul Kim, Chungcheongbuk-do, KR;
Yong Woon Yeo, Chungcheongbuk-do, KR;
Yong Tae Kwon, Chungcheongbuk-do, KR;
Young Seok Lee, Daegu, KR;
Assignee:
NEPES LAWEH Corporation, Cheongju-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/673 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76871 (2013.01); H01L 21/67333 (2013.01); H01L 21/76802 (2013.01); H01L 24/09 (2013.01);
Abstract
A technical concept of the present disclosure provides a method of producing a semiconductor package, the method including operations of: arranging a plurality of wafers on a tray, forming an interconnect structure on the tray and the plurality of wafers, and separating the plurality of wafers from the tray.