Chungcheongbuk-do, South Korea

Yong Tae Kwon

USPTO Granted Patents = 8 

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Chungcheongbuk-do, KR (2020 - 2021)
  • Cheongju-si, KR (2022 - 2023)

Company Filing History:


Years Active: 2020-2025

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8 patents (USPTO):Explore Patents

Title: Yong Tae Kwon: Innovator in Semiconductor Packaging

Introduction

Yong Tae Kwon is a prominent inventor based in Chungcheongbuk-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of eight patents. His innovative designs have advanced the technology used in semiconductor packages, making them more efficient and reliable.

Latest Patents

Among his latest patents is a wafer-level design and wiring pattern for a semiconductor package. This invention includes a semiconductor chip with a chip pad, a first insulating layer featuring a via hole, and a wiring pattern connected to the chip pad. Additionally, he has developed a semiconductor package that comprises a first molding layer and a second molding layer with different thermal expansion coefficients. This design enhances the performance and durability of semiconductor packages.

Career Highlights

Yong Tae Kwon has worked with notable companies such as Nepes Co., Ltd. and Nepes Laweh Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

He has collaborated with talented individuals in the industry, including Dong Hoon Oh and Su Yun Kim. These partnerships have fostered a creative environment that has led to innovative solutions in semiconductor packaging.

Conclusion

Yong Tae Kwon's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor technologies.

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