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For the Inventor, By the Inventor

Chungcheongbuk-do, South Korea

Yong Tae Kwon

This inventor holds 10 USPTO granted patents and 5 published patent applications. Top assignees: Nepes Co., Ltd., Nepes Laweh Corporation. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yong Tae Kwon. Retrieved from https://idiyas.com/inventor/yong-tae-kwon-ql3jat11

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 

% Patents Active = 100.0

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Chungcheongbuk-do, KR (2020 - 2021)
  • Cheongju-si, KR (2022 - 2023)

Company Filing History:

goldMedal9 out of 27 
 
Nepes Co., Ltd.
 patents
silverMedal3 out of 4 
 
Nepes Laweh Corporation
 patents
where one patent can have more than one assignee

Years Active: 2020-2026

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10 patents (USPTO):Explore Patents
1. 12525547 - Semiconductor package and method for manufacturing same (2026-01-13),
2. 12494421 - Semiconductor package including redistribution structure, and method of manufacturing the same (2025-12-09),
3. 12205904 - Wafer-level design and wiring pattern for a semiconductor package (2025-01-21),
4. 12198997 - Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients (2025-01-14),
5. 12183704 - Semiconductor package and method for manufacturing the same (2024-12-31),
6. 12125775 - Semiconductor package and method for manufacturing the same (2024-10-22),
7. 11545451 - Semiconductor package (2023-01-03),
8. 11476211 - Semiconductor package and manufacturing method thereof (2022-10-18),
9. 10964656 - Semiconductor package and method of manufacturing same (2021-03-30),
10. 10804146 - Method for producing semiconductor package (2020-10-13),

Title: Yong Tae Kwon: Innovator in Semiconductor Packaging

Introduction

Yong Tae Kwon is a prominent inventor based in Chungcheongbuk-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of eight patents. His innovative designs have advanced the technology used in semiconductor packages, making them more efficient and reliable.

Latest Patents

Among his latest patents is a wafer-level design and wiring pattern for a semiconductor package. This invention includes a semiconductor chip with a chip pad, a first insulating layer featuring a via hole, and a wiring pattern connected to the chip pad. Additionally, he has developed a semiconductor package that comprises a first molding layer and a second molding layer with different thermal expansion coefficients. This design enhances the performance and durability of semiconductor packages.

Career Highlights

Yong Tae Kwon has worked with notable companies such as Nepes Co., Ltd. and Nepes Laweh Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

He has collaborated with talented individuals in the industry, including Dong Hoon Oh and Su Yun Kim. These partnerships have fostered a creative environment that has led to innovative solutions in semiconductor packaging.

Conclusion

Yong Tae Kwon's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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