Chungcheongbuk-do, South Korea

Nam Chul Kim

This inventor holds 1 USPTO granted patent. Top assignee: Nepes Laweh Corporation. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nam Chul Kim. Retrieved from https://idiyas.com/inventor/nam-chul-kim-ejfbz8ye

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Nam Chul Kim

Introduction

Nam Chul Kim is a notable inventor based in Chungcheongbuk-do, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for producing semiconductor packages.

Latest Patents

Nam Chul Kim holds a patent for a "Method for producing semiconductor package." This technical concept outlines a process that includes arranging a plurality of wafers on a tray, forming an interconnect structure on the tray and the wafers, and subsequently separating the wafers from the tray. This method enhances the efficiency and effectiveness of semiconductor packaging.

Career Highlights

Nam Chul Kim is currently employed at Nepes Laweh Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the company's capabilities in this competitive field.

Collaborations

Some of his coworkers include Yong Woon Yeo and Yong Tae Kwon, who contribute to the innovative environment at Nepes Laweh Corporation.

Conclusion

Nam Chul Kim's contributions to semiconductor technology through his patent and work at Nepes Laweh Corporation highlight his role as a key innovator in the industry. His efforts continue to shape the future of semiconductor packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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