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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11062990 B1

PDFFull Text
Date of Patent:
Jul. 13, 2021

Filed:

May. 28, 2019

Semiconductor package of using insulating frame

Applicant:

Nepes Co., Ltd., Chungcheongbuk-do, KR;

Inventors:

Yongtae Kwon, Cheongju-si, KR;

Junkyu Lee, Cheongju-si, KR;

Jaecheon Lee, Cheongju-si, KR;

Mina Yoon, Cheongju-si, KR;

Assignee:

NEPES LAWEH CORPORATION;

Attorney:

Renaissance IP Law Group LLP

Primary Examiner:

Monica D Harrison

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/29 (2006.01); H01L 23/06 (2006.01); H01L 23/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/565 (2013.01); H01L 23/06 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H01L 23/3128 (2013.01); H01L 23/5283 (2013.01); H01L 23/552 (2013.01); H01L 23/60 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/73203 (2013.01);
Abstract

A semiconductor package using an insulating frame of various is disclosed. The insulating frame has a through hole therein, and the semiconductor chip is mounted in the through hole. Further, a via hole is provided in the periphery of the through hole, and a via contact filling the via hole is provided. Whereby the pad of the semiconductor chip is electrically connected to the via contact through the distribution layer. Further, an adhesive buffer layer for increasing the adhesive force is introduced into the upper portion of the insulating frame.

Find Patent Forward Citations

Kwon, Yongtae. (2021). Semiconductor package of using insulating frame (U.S. Patent No. 11062990). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11062990

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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