Company Filing History:
Years Active: 2021-2022
Title: Yongtae Kwon: Innovator in Semiconductor Packaging
Introduction
Yongtae Kwon is a notable inventor based in Cheongju-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to improving the durability and manufacturing processes of chip packages.
Latest Patents
Kwon's latest patents include a chip package with a connection portion that passes through an encapsulation portion. This invention aims to enhance the strength of the package while simplifying the manufacturing process. By forming a reinforcing layer on a chip using an adhesive layer, Kwon's design integrates the chip and the reinforcing layer with a molding layer. This structure improves the package's durability and strength by incorporating solder balls between a base substrate and a re-wiring layer. Additionally, a wiring layer can be formed directly on the molding layer using polyimide (PI), eliminating the need for a separate insulating layer.
Another significant patent is a semiconductor package utilizing an insulating frame. This design features a through hole where the semiconductor chip is mounted. A via hole surrounds the through hole, allowing for electrical connections through a distribution layer. An adhesive buffer layer is also introduced to enhance the adhesive force, further improving the package's reliability.
Career Highlights
Throughout his career, Yongtae Kwon has worked with reputable companies such as Nepes Co., Ltd. and Nepes Laweh Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and packaging solutions.
Collaborations
Kwon has collaborated with notable coworkers, including Eung Ju Lee and Yong Woon Yeo. Their combined efforts in the field of semiconductor packaging have led to advancements that benefit the industry.
Conclusion
Yongtae Kwon's innovative contributions to semiconductor packaging demonstrate his commitment to enhancing technology in this field. His patents reflect a deep understanding of manufacturing processes and materials, positioning him as a key figure in the industry.