Nepes Co., Ltd.

Nepes Laweh Corporation

Yongtae Kwon

Jun Kyu Lee

Yun Mook Park

Yong Woon Yeo

Eung Ju Lee

Hyo Young Kim

Jaecheon Lee

Mina Yoon

Seok Hwi Cheon

Junkyu Lee

Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer without using a separate insulating layer formed on the molding layer as in the conventional art.

Chip package with connection portion that passes through an encapsulation portion

A semiconductor package using an insulating frame of various is disclosed. The insulating frame has a through hole therein, and the semiconductor chip is mounted in the through hole. Further, a via hole is provided in the periphery of the through hole, and a via contact filling the via hole is provided. Whereby the pad of the semiconductor chip is electrically connected to the via contact through the distribution layer. Further, an adhesive buffer layer for increasing the adhesive force is introduced into the upper portion of the insulating frame.

Semiconductor package of using insulating frame

Growing community of inventors

Cheongju-si, South Korea

Yongtae Kwon