Dong Hoon Oh

Title: The Innovative Contributions of Dong Hoon Oh

Introduction

Dong Hoon Oh is a prominent inventor based in Cheongju-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His work focuses on enhancing the design and functionality of semiconductor packages, which are crucial components in modern electronics.

Latest Patents

Dong Hoon Oh's latest patents include innovative designs that improve semiconductor packaging. One notable patent describes a wafer-level design and wiring pattern for a semiconductor package. This design features a semiconductor chip with a chip pad, a first insulating layer with a via hole, and a wiring pattern that connects to the chip pad. The first insulating layer has a unique surface roughness that enhances its performance. Another significant patent involves a semiconductor package comprising a first molding layer and a second molding layer with different thermal expansion coefficients. This design ensures better thermal management and reliability in semiconductor applications.

Career Highlights

Throughout his career, Dong Hoon Oh has worked with reputable companies in the semiconductor industry. He has been associated with Nepes Co., Ltd. and Nepes Laweh Corporation, where he has contributed to various innovative projects. His expertise in semiconductor technology has positioned him as a key player in the field.

Collaborations

Dong Hoon Oh has collaborated with talented individuals such as Yong Tae Kwon and Su Yun Kim. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in semiconductor packaging.

Conclusion

Dong Hoon Oh's contributions to semiconductor packaging through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the development of advanced electronic components, ensuring better performance and reliability in technology.