Chungcheongbuk-do, South Korea

Hyo Gi Jo

This inventor holds 2 USPTO granted patents. Top assignees: Nepes Co., Ltd., Nepes Laweh Corporation. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyo Gi Jo. Retrieved from https://idiyas.com/inventor/hyo-gi-jo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2024

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2 patents (USPTO):Explore Patents

Title: Hyo Gi Jo: Innovator in Semiconductor Technology

Introduction

Hyo Gi Jo is a notable inventor based in Chungcheongbuk-do, South Korea. She has made significant contributions to the field of semiconductor technology, holding two patents that showcase her innovative approach to semiconductor packaging.

Latest Patents

Hyo Gi Jo's latest patents include a semiconductor package and method for manufacturing the same. The first patent describes a semiconductor package that features a first semiconductor chip with a bottom surface adjacent to a first active layer and a top surface opposite to the bottom surface. It includes a first adhesive layer on the top surface, a first conductive stud on the bottom surface connected to the active layer, and a first conductive post outside the chip. The design also incorporates a redistribution structure beneath the chip, which includes a redistribution pattern connected to the conductive stud and post, surrounded by a molding layer. The coplanarity of the top surfaces of the molding layer, conductive post, and adhesive layer is also highlighted.

The second patent similarly describes a semiconductor package with a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to it. This design includes a conductive stud on the first surface, an adhesive layer on the second surface, and a conductive post outside the chip. It features both a first and a second redistribution structure, each with their respective insulation layers, and a molding layer that surrounds the semiconductor chip and its components.

Career Highlights

Hyo Gi Jo has worked with prominent companies in the semiconductor industry, including Nepes Co., Ltd. and Nepes Laweh Corporation. Her experience in these organizations has contributed to her expertise and innovative capabilities in semiconductor technology.

Collaborations

Hyo Gi Jo has collaborated with notable colleagues such as Byung Cheol Kim and Yong Tae Kwon. These partnerships have likely fostered a creative environment that encourages innovation and the development of advanced semiconductor solutions.

Conclusion

Hyo Gi Jo is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the field. Her patents reflect her commitment to innovation and her ability to address complex challenges in semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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