The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Dec. 23, 2019
Nepes Co., Ltd., Chungcheongbuk-do, KR;
Gi Jo Jung, Cheongju-si, KR;
Chang Yong Jo, Cheongju-si, KR;
Young Mo Lee, Cheongju-si, KR;
Jung Sic Oh, Cheongju-si, KR;
Jong Ho Han, Cheongju-si, KR;
NEPES CO., LTD., Chungcheongbuk-Do, KR;
Abstract
A semiconductor package includes a semiconductor chip including a chip pad on a first surface thereof, an external pad electrically connected to the chip pad of the semiconductor chip, an external connection terminal covering the external pad, and an intermediate layer between the external pad and the external connection terminal, the intermediate layer including a third metal material that is different from a first metal material included in the external pad and a second metal material included in the external connection terminal.