Dong-Hoon Oh

Title: Innovations of Dong-Hoon Oh in Semiconductor Packaging

Introduction

Dong-Hoon Oh is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology. His work focuses on enhancing the performance and reliability of semiconductor packages.

Latest Patents

Dong-Hoon Oh's latest patents include a manufacturing method for a semiconductor package that features a filling member and a membrane member. This invention discloses a semiconductor package comprising a fan-out structure, which includes a wiring unit with an insulation layer and a wiring layer. A semiconductor chip is mounted on the wiring unit and is coupled to the wiring layer through flip-chip bonding. The filling member is designed to fill the gap between the semiconductor chip and the wiring unit, while a film member performs coating to cover one surface of the semiconductor chip, filling member, and wiring unit.

Another notable patent is for a semiconductor package and its manufacturing method. This invention includes a wiring structure with multiple layers, including an insulating layer and a wiring layer. A semiconductor chip is mounted on this wiring and is electrically connected to the wiring layer through a bonding pad. The design features a cover member that protects the side surfaces of the semiconductor chip and wiring, minimizing electromagnetic interference and enhancing signal speed.

Career Highlights

Dong-Hoon Oh is currently employed at Nepes Co., Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced packaging solutions that address the challenges of modern electronics.

Collaborations

He collaborates with talented coworkers, including Jun-Kyu Lee and Tae-Won Kim, who contribute to the innovative projects at Nepes Co., Ltd. Their teamwork fosters a creative environment that drives technological advancements.

Conclusion

Dong-Hoon Oh's contributions to semiconductor packaging through his patents reflect his dedication to innovation in the field. His work not only enhances the performance of semiconductor devices but also sets a foundation for future advancements in technology.