The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2022
Filed:
Apr. 03, 2017
Nepes Co., Ltd., Chungcheongbuk-do, KR;
Yong-Tae Kwon, Cheongju-si, KR;
Jun-Kyu Lee, Cheongju-si, KR;
Si Woo Lim, Daegu, KR;
Dong-Hoon Oh, Seoul, KR;
Jun-Sung Ma, Seoul, KR;
Tae-Won Kim, Cheongju-si, KR;
NEPES CO., LTD., Chungcheongbuk-Do, KR;
Abstract
A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.