Company Filing History:
Years Active: 2022
Title: Jun-Sung Ma: Innovator in Semiconductor Packaging
Introduction
Jun-Sung Ma is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Jun-Sung Ma holds a patent for a manufacturing method for a semiconductor package that includes a filling member and a membrane member. This patent describes a semiconductor package comprising a fan-out structure and outlines a manufacturing method for it. The invention includes a wiring unit with an insulation layer and a wiring layer, a semiconductor chip mounted on the wiring unit, a filling member to fill the gap between the semiconductor chip and the wiring unit, and a film member for coating to cover one surface of each component.
Career Highlights
Jun-Sung Ma is associated with Nepes Co., Ltd., where he applies his knowledge and skills in semiconductor technology. His innovative approach has led to advancements in the manufacturing processes of semiconductor packages, contributing to the overall progress in the industry.
Collaborations
He has collaborated with notable colleagues, including Yong-Tae Kwon and Jun-Kyu Lee, to further enhance the development of semiconductor technologies. Their teamwork has fostered an environment of innovation and creativity within their projects.
Conclusion
Jun-Sung Ma's contributions to semiconductor packaging through his patent and collaborative efforts highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor technology, paving the way for future innovations.