Jun-Kyu Lee is an accomplished inventor based in Chungcheongbuk-do, South Korea, with an impressive record of 6 patents to his name. His expertise lies in the field of semiconductor packaging, where he has made significant contributions through his innovative designs and manufacturing methods.

Latest Patents

Among his latest patents, Jun-Kyu Lee has developed a manufacturing method for a semiconductor package that includes a filling member and a membrane member. This innovation features a fan-out structure, which enhances the efficiency and reliability of semiconductor packages. His patent describes a semiconductor package that consists of a wiring unit with an insulation layer and a wiring layer, a semiconductor chip mounted and connected via flip-chip bonding, as well as a filling member that fills the gap between the chip and the wiring unit. Additionally, there is a film member that covers the semiconductor chip, filling member, and wiring unit.

Another notable patent is focused on providing a semiconductor package and a method for its manufacturing. This innovation includes an interconnection part composed of an insulation layer and an interconnection layer, with the semiconductor chip positioned above, connected electrically to the interconnection layer through a bonding pad. Furthermore, it features an EMI (Electromagnetic Interference) shielding part that covers both the semiconductor chip and the interconnection part.

Career Highlights

Jun-Kyu Lee is currently employed at Nepes Co., Ltd., a company known for its advancements in semiconductor technologies. His role involves leveraging his expertise to innovate and enhance semiconductor packaging solutions, contributing to the company’s reputation as a leader in this critical industry.

Collaborations

Throughout his career, Jun-Kyu Lee has worked alongside notable colleagues, including Yong-Tae Kwon and Dong-Hoon Oh. Their collaboration has fostered a creative environment that nurtures innovative solutions in semiconductor technology.

Conclusion

With his substantial contributions to semiconductor packaging innovations, Jun-Kyu Lee stands out as a prominent figure in the field. His patents not only reflect his innovative spirit but also serve to advance the technology that is foundational to modern electronics. As he continues to work at Nepes Co., Ltd., the impact of his inventions will likely resonate throughout the industry for years to come.

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