Location History:
- Chungcheongbuk-do, KR (2019)
- Cheongju-si, KR (2022)
Company Filing History:
Years Active: 2019-2022
Title: Innovations of Tae-Won Kim in Semiconductor Packaging
Introduction
Tae-Won Kim is a notable inventor based in Chungcheongbuk-do, South Korea. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to technology.
Latest Patents
His latest patents include a manufacturing method for a semiconductor package that features a filling member and a membrane member. This semiconductor package comprises a fan-out structure and includes a wiring unit with an insulation layer and a wiring layer. A semiconductor chip is mounted on the wiring unit and is coupled to the wiring layer through flip-chip bonding. The design incorporates a filling member that fills the gap between the semiconductor chip and the wiring unit, along with a film member that coats the surfaces of the semiconductor chip, filling member, and wiring unit.
Another patent focuses on a semiconductor package and its manufacturing method. This package includes a wiring structure with multiple layers, including an insulating layer and a wiring layer. A semiconductor chip is mounted on this wiring and is electrically connected to the wiring layer through a bonding pad. The design features a cover member that protects the side surfaces of the semiconductor chip and wiring, while an encapsulant seals the cover member. This innovative design reduces electromagnetic interference, minimizes noise during operations, and enhances signal speed.
Career Highlights
Tae-Won Kim is currently employed at Nepes Co., Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has significantly impacted the efficiency and performance of semiconductor devices.
Collaborations
He collaborates with talented coworkers, including Jun-Kyu Lee and Dong-Hoon Oh, who contribute to the innovative environment at Nepes Co., Ltd.
Conclusion
Tae-Won Kim's contributions to semiconductor packaging through his patents demonstrate his expertise and commitment to advancing technology in this field. His work not only enhances the performance of semiconductor devices but also sets a foundation for future innovations.