logo

For the Inventor, By the Inventor

Hillsboro, OR, United States of America

Kimin Jun

USPTO Granted Patents = 74 

 

Average Co-Inventor Count = 4.4

ph-index = 6

Forward Citations = 136(Granted Patents)

Forward Citations (Not Self Cited) = 111(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hillsboro, OR (US) (2015 - 2024)
  • Portland, OR (US) (2019 - 2024)

Company Filing History:

goldMedal73 out of 54,750 
 
Intel Corporation
 patents
silverMedal1 out of 8,373 
 
Massachusetts Institute of Technology
 patents

Years Active: 2015-2025

Loading Chart...
Loading Chart...
Areas of Expertise:
Hybrid Bonding Technology
Monolithic Chip Stacking
Microelectronic Assemblies
Three-Dimensional Integrated Circuits
Backside Contact Structures
Acoustic Resonators
Vertical Memory Cells
Transistor Stacking Techniques
Integrated Circuit Device Structures
Through Silicon Vias
Metallization Structures
Dielectric Channel Transistors
74 patents (USPTO):Explore Patents
1. 12500207 - Packaging architecture with intermediate routing layers (2025-12-16),
2. 12469630 - Inductor and transformer semiconductor devices using hybrid bonding technology (2025-11-11),
3. 12463180 - Monolithic chip stacking using a die with double-sided interconnect layers (2025-11-04),
4. 12456702 - Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets (2025-10-28),
5. 12417978 - Microelectronic assemblies having backside die-to-package interconnects (2025-09-16),
6. 12406956 - Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers (2025-09-02),
7. 12375060 - Digitally controlled lithographically-defined multi-frequency acoustic resonators (2025-07-29),
8. 12362325 - Monolithic chip stacking using a die with double-sided interconnect layers (2025-07-15),
9. 12300579 - Liquid cooled interposer for integrated circuit stack (2025-05-13),
10. 12288810 - Backside contact structures and fabrication for metal on both sides of devices (2025-04-29),
11. 12266682 - Capacitors and resistors at direct bonding interfaces in microelectronic assemblies (2025-04-01),
12. 12266570 - Self-aligned interconnect structures and methods of fabrication (2025-04-01),
13. 12199018 - Direct bonding in microelectronic assemblies (2025-01-14),
14. 12176323 - Microelectronic assemblies (2024-12-24),
15. 12107060 - Microelectronic assemblies with inductors in direct bonding regions (2024-10-01),

Title: The Innovative Mind of Kimin Jun

Introduction: Kimin Jun, a talented inventor based in Hillsboro, Oregon, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kimin Jun holds several patents in the areas of artificial intelligence, machine learning, and semiconductor technology, showcasing his expertise and creativity in these cutting-edge fields.

Career Highlights: With a background in engineering and a passion for pushing the boundaries of what is possible, Kimin Jun has had a successful career working for leading tech companies, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Throughout his career, Kimin Jun has collaborated with top researchers, engineers, and scientists to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Kimin Jun's innovative spirit, combined with his technical acumen, has solidified his reputation as a visionary inventor in the technology sector. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…