Kimin Jun

This inventor holds 86 USPTO granted patents and 47 published patent applications and 5 EPO patents, primarily in Microelectronic Packaging (CPC class H01L). Top assignees: Intel Corporation, Massachusetts Institute of Technology. Active years: 2015-2026.

USPTO Granted Patents = 86 (Patent Applications = 47)

% Patents Active = 83.7

EPO Patents = 5 (Patent Applications = 36)

Average Co-Inventor Count = 4.8

ph-index = 7

Forward Citations = 180(Granted Patents)

Forward Citations (Not Self Cited) = 111(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hillsboro, OR (US) (2015 - 2024)
Portland, OR (US) (2019 - 2024)

Company Filing History:

Massachusetts Institute of Technology

patents

Years Active: 2015-2026

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Areas of Expertise:

Hybrid Bonding

Microelectronic Assemblies

Quasi-Monolithic Chip

3D Integrated Circuits

Backside Power Delivery

Interconnect Structures

Stacked Transistors

Die-to-Package Interconnects

Memory Stacking

Acoustic Resonators

Through Silicon Vias

Heterogeneous Bonding

86 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12733517 - Packaging architecture with patterned through-dielectric vias and redistribution layers (2026-09-08),

2. 12713924 - DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A COMPOSITE CHIPLET (2026-08-18),

3. 12707932 - Handling assembly, handling system and method (2026-08-11),

4. 12701724 - Microelectronic assemblies with inductors in direct bonding regions (2026-08-04),

5. 12696798 - Active device layer at interconnect interfaces (2026-07-28),

6. 12672355 - Gallium nitride (GaN) epitaxy on patterned substrate for integrated circuit technology (2026-06-30),

7. 12667001 - Integrated packaging architecture with solder and non-solder interconnects (2026-06-23),

8. 12604786 - Method of atomic diffusion hybrid bonding and apparatus made from same (2026-04-14),

9. 12581968 - Package architecture of large dies using quasi-monolithic chip layers (2026-03-17),

10. 12581938 - Package architecture for quasi-monolithic chip with backside power (2026-03-17),

11. 12538841 - Quasi-monolithic die architectures (2026-01-27),

12. 12526985 - Back-side reveal for power delivery to backend memory with frontend transistors and backend memroy cells (2026-01-13),

13. 12500207 - Packaging architecture with intermediate routing layers (2025-12-16),

14. 12469630 - Inductor and transformer semiconductor devices using hybrid bonding technology (2025-11-11),

15. 12463180 - Monolithic chip stacking using a die with double-sided interconnect layers (2025-11-04),

Title: The Innovative Mind of Kimin Jun

Introduction: Kimin Jun, a talented inventor based in Hillsboro, Oregon, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kimin Jun holds several patents in the areas of artificial intelligence, machine learning, and semiconductor technology, showcasing his expertise and creativity in these cutting-edge fields.

Career Highlights: With a background in engineering and a passion for pushing the boundaries of what is possible, Kimin Jun has had a successful career working for leading tech companies, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Throughout his career, Kimin Jun has collaborated with top researchers, engineers, and scientists to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Kimin Jun's innovative spirit, combined with his technical acumen, has solidified his reputation as a visionary inventor in the technology sector. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators.