The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Jun. 10, 2021
Intel Corporation, Santa Clara, CA (US);
Han Wui Then, Portland, OR (US);
Adel A. Elsherbini, Tempe, AZ (US);
Kimin Jun, Portland, OR (US);
Johanna M. Swan, Scottsdale, AZ (US);
Shawna M. Liff, Scottsdale, AZ (US);
Sathya Narasimman Tiagaraj, San Jose, CA (US);
Gerald S. Pasdast, San Jose, CA (US);
Aleksandar Aleksov, Chandler, AZ (US);
Feras Eid, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A die assembly comprising: a first component layer having conductive through-connections in an insulator, a second component layer comprising a die, and an active device layer (ADL) at an interface between the first component layer and the second component layer. The ADL comprises active elements electrically coupled to the first component layer and the second component layer. The die assembly further comprises a bonding layer electrically coupling the ADL to the second component layer. In some embodiments, the die assembly further comprises another ADL at another interface between the first component layer and a package support opposite to the interface. The first component layer may comprise another die having through-substrate vias (TSVs). The die and the another die may be fabricated using different process nodes.