Sathya Narasimman Tiagaraj

Title: Innovations of Sathya Narasimman Tiagaraj

Introduction

Sathya Narasimman Tiagaraj is a notable inventor based in Chandler, Arizona. He has made significant contributions to the field of microelectronics, holding a total of four patents. His work primarily focuses on enhancing power delivery and metallization structures in integrated circuit devices.

Latest Patents

One of his latest patents is titled "Power delivery through capacitor-dies in a multi-layered microelectronic assembly." This invention provides a microelectronic assembly that includes an integrated circuit (IC) die in a first layer and multiple IC dies in a second layer. The design allows for efficient electrical coupling between adjacent IC dies, utilizing interconnects with a pitch of less than 10 micrometers. The IC die also incorporates capacitors and voltage regulator circuitry.

Another significant patent is "Skip level vias in metallization layers for integrated circuit devices." This patent describes an integrated circuit device that features a metallization structure on an electronic substrate. The structure includes multiple dielectric material layers and a power/ground structure, with skip level vias that extend through these layers, ensuring continuous conductive material.

Career Highlights

Sathya Narasimman Tiagaraj is currently employed at Intel Corporation, where he continues to innovate in the field of microelectronics. His work has contributed to advancements in integrated circuit technology, making devices more efficient and reliable.

Collaborations

He has collaborated with notable coworkers, including Gerald S Pasdast and Adel A Elsherbini, who have also contributed to the field of microelectronics.

Conclusion

Sathya Narasimman Tiagaraj's innovative patents and contributions to Intel Corporation highlight his significant role in advancing microelectronic technology. His work continues to influence the development of efficient integrated circuit devices.