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For the Inventor, By the Inventor

Santa Clara, CA, United States of America

Intel Corporation


USPTO Granted Patents = 54,890



Trademarks = 116

Forward Citations = 595,677

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25,805 inventors (with patents filed for the assignee):

goldMedal Jack T Kavalieros (615 out of 628 patents)

silverMedal Abhishek R Appu (508 out of 508 patents)

bronzeMedal Joydeep Ray (500 out of 500 patents)

4.  Tahir Ghani (493 out of 507 patents)

5.  Altug Koker (492 out of 492 patents)

6.  Qinghua Li (492 out of 513 patents)

7.  Robert S Chau (490 out of 495 patents)

8.  Vincent J Zimmer (469 out of 487 patents)

9.  Elmoustapha Ould-Ahmed-Vall (458 out of 459 patents)

10.  Ned M Smith (440 out of 499 patents)

11.  Carlos Cordeiro (414 out of 441 patents)

12.  Gilbert W Dewey (397 out of 400 patents)

13.  Ravi Pillarisetty (391 out of 395 patents)

14.  Francesc Guim Bernat (374 out of 378 patents)

15.  Marko Radosavljevic (372 out of 378 patents)


Core Competencies:
Micro-channel Heatsink
Photonic Device Manufacturing
Optical Modulation
Machine Learning Architecture
Dynamic Random-access Memory
LIDAR Applications
Hybrid Hardware Accelerator
User Adaptive Triggering
Two-phase Immersion Cooling
Cryptographic Computing
Synchronized Transmit Opportunity
Repetitive Task Analytics

54,890 patents:

1. 12527078 - Gate-all-around integrated circuit structures having epitaxial source or drain region lateral isolation (2026-01-13),
2. 12527026 - Field-effect transistor with hybrid switching mechanism (2026-01-13),
3. 12526985 - Back-side reveal for power delivery to backend memory with frontend transistors and backend memroy cells (2026-01-13),
4. 12526969 - High speed grid array module (2026-01-13),
5. 12526771 - OFDMA trigger based peer to peer operations with dual-stage triggering (2026-01-13),
6. 12526598 - Methods and apparatus to generate spatial audio based on computer vision (2026-01-13),
7. 12526589 - Method and system of audio processing using cochlear-simulating spike data (2026-01-13),
8. 12526419 - Bit-rate-based hybrid encoding on video hardware assisted central processing units (2026-01-13),
9. 12525563 - Microelectronic assemblies including stacked dies coupled by a through dielectric via (2026-01-13),
10. 12525562 - Assembly of 2XD module using high density interconnect bridges (2026-01-13),
11. 12525545 - HBI die fiducial architecture with cantilever fiducials for smaller die size and better yields (2026-01-13),
12. 12525544 - Ultra small molded module integrated with die by module-on-wafer assembly (2026-01-13),
13. 12525497 - Microelectronic assemblies with adaptive multi-layer encapsulation materials (2026-01-13),
14. 12525496 - Glass vias and planes with reduced tapering (2026-01-13),
15. 12525488 - Interconnect line structures with metal chalcogenide cap materials (2026-01-13),
Intel Corporation is an American multinational corporation and technology company. It is one of the world's largest and highest-valued semiconductor chip manufacturers, based on revenue. Intel's products primarily include processors, chipsets, motherboard chipsets, wireless and wired connectivity products, among others. The company is known for its innovation and advancement in the field of computing and technology.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 13 2026

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54,890 Patents

#1 in Santa Clara, CA

#1 in California

#2 in US

#6 in the World

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Santa Clara, CA, United States of America

Intel Corporation

Forward Citations = 595,677

25,805 inventors:

goldMedal Jack T Kavalieros (615 out of 628 patents)

silverMedal Abhishek R Appu (508 out of 508 patents)

bronzeMedal Joydeep Ray (500 out of 500 patents)

4.  Tahir Ghani (493 out of 507 patents)

5.  Altug Koker (492 out of 492 patents)

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