The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Dec. 28, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Ala Omer, Phoenix, AZ (US);

Peumie Abeyratne Kuragama, Chandler, AZ (US);

Jieying Kong, Chandler, AZ (US);

Wendy Lin, Chandler, AZ (US);

Ao Wang, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H10P 70/00 (2026.01); H10P 72/72 (2026.01); H10P 95/00 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32715 (2013.01); H10P 95/08 (2026.01); H01J 2237/2007 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3355 (2013.01); H01J 2237/336 (2013.01); H10P 70/234 (2026.01); H10P 72/72 (2026.01);
Abstract

This disclosure describes designs and methods for via cleaning, peeling protective film, and providing mild surface roughening and cleaning of a computer chip. A system may include a first electrode configured to generate plasma associated with cleaning vias by etching a residual material associated with smearing; an electrostatic stage configured to generate an electrostatic force associated with peeling the dielectric protective film from the semiconductor; and a stage on which the semiconductor is positioned while the electrostatic stage peels the dielectric protective film from the semiconductor, wherein the plasma is further associated with roughening a surface of the semiconductor after peeling the dielectric protective film from the semiconductor.


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