The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jun. 13, 2023
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Tolga Acikalin, San Jose, CA (US);
Tae Young Yang, Portland, OR (US);
Shuhei Yamada, Vancouver, WA (US);
Telesphor Kamgaing, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01P 3/08 (2006.01); H01Q 13/02 (2006.01); H10W 70/60 (2026.01); H10W 70/63 (2026.01); H10W 70/692 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01P 3/08 (2013.01); H01Q 13/02 (2013.01); H10W 70/611 (2026.01); H10W 70/635 (2026.01); H10W 70/692 (2026.01); H10W 90/00 (2026.01); H10W 90/724 (2026.01);
Abstract
Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.