The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jun. 28, 2022
Intel Corporation, Santa Clara, CA (US);
Cemil S. Geyik, Gilbert, AZ (US);
Kristof Kuwawi Darmawikarta, Chandler, AZ (US);
Zhiguo Qian, Chandler, AZ (US);
Kemal Aygun, Tempe, AZ (US);
Jung Kyu Han, Chandler, AZ (US);
Srinivas V. Pietambaram, Chandler, AZ (US);
Rengarajan Shanmugam, Chandler, AZ (US);
Robert L. Sankman, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed herein are silver-coated conductive structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line, a first material layer on a top surface and on side surfaces of the conductive line, the first material layer including silver, and a second material layer on the first material layer, the second material layer including silicon or aluminum, and one or more of nitrogen and oxygen.