Robert L Sankman

Title: Robert L Sankman: Innovator and Patent Holder Extraordinaire

Introduction:

In the world of innovations and patents, there are individuals who stand out for their remarkable contributions. One such individual is Robert L Sankman, a prolific inventor based in Phoenix, AZ (US). With an impressive portfolio of 126 patents to his name, Sankman has made significant contributions to the field of embedded multi-die interconnect bridges and semiconductor packaging.

Latest Patents:

Sankman's recent patents showcase his expertise in embedded multi-die interconnect bridge packages and their assembly. One of his latest inventions is the "Embedded Multi-Die Interconnect Bridge Packages with Lithographically Formed Bumps and Methods of Assembling Same." This invention involves the use of photolithographically formed interconnects coupled to laser-drilled interconnects, leading to improved structure planarization during fabrication and assembly.

Another notable patent is the "Ultrathin Bridge and Multi-Die Ultrafine Pitch Patch Architecture and Method of Making." This invention relates to semiconductor packages featuring a bridge with a hybrid layer on a high-density packaging substrate, multiple dies over the bridge and substrate, and through mold vias. This innovation streamlines the connection between the dies and the substrate, enhancing the overall functionality and efficiency of the semiconductor package.

Career Highlights:

Throughout his career, Sankman has demonstrated an exceptional aptitude for innovation and problem-solving. He has worked with renowned companies such as Intel Corporation and Intel IP Corporation, where he has leveraged his expertise in semiconductor packaging and embedded interconnects. His contributions have made a significant impact on the development of advanced technologies in these areas.

Collaborations:

Sankman's innovation journey hasn't been a solitary one. He has worked alongside accomplished professionals in the field. Two noteworthy collaborators include Debendra Mallik and John Stephen Guzek. These collaborations have likely played a pivotal role in fostering creativity, knowledge exchange, and groundbreaking advancements in the domain of embedded multi-die interconnect bridges.

Conclusion:

Robert L Sankman's impressive portfolio of 126 patents speaks volumes about his dedication and expertise in the field of embedded multi-die interconnect bridges and semiconductor packaging. His recent inventions demonstrate his commitment to pushing the boundaries of technology and finding innovative solutions to complex challenges. Sankman's collaborations and industry experience have undoubtedly contributed to his success as an inventor and patent holder. With each new patent, Sankman continues to shape the future of the semiconductor industry, leaving an indelible mark on the field of innovations and patents.