Inventors with similar research interests:
Location History:
- Keeling City, TW (1996)
- Keelung City, TW (1997)
- Keeling, TW (1998)
- Pao-Sheng County, TW (1999)
- Hsiu-chu, TW (1997 - 2002)
- Koelung, TW (2005)
- Keelung, TW (1996 - 2011)
- Hinchu, TW (2017 - 2019)
- Hsinchuy, TW (2019)
- Chupei, TW (2021 - 2022)
- Hsin-Chu, TW (1997 - 2024)
Years Active: 1996-2025
Title: Innovator Chen-Hua Douglas Yu: Pioneering Advanced Packaging Technologies
Introduction
Chen-Hua Douglas Yu, an esteemed inventor based in Hsin-Chu, Taiwan, has made significant contributions to the field of advanced packaging technologies. With an impressive portfolio of 1,839 patents, his work continues to influence the semiconductor industry and enhance the performance of electronic devices.
Latest Patents
Among his latest innovations, two notable patents highlight his expertise:
1. **Cross-wafer RDLs in Constructed Wafers** - This method involves placing multiple package components over a carrier and encapsulating them in an encapsulant. It includes the formation of a light-sensitive dielectric layer, which is exposed and developed to create openings that expose the conductive features of the components. Redistribution lines are then formed, with one exceeding a length of approximately 26 mm, resulting in a reconstructed wafer.
2. **Package with Integrated Optical Die and Method Forming Same** - This patent details a method for creating a package that incorporates an optical die and a protection layer. The optical die features a micro lens, and the protection layer is removed to expose a recess in the encapsulant, allowing the micro lens to face outward. This package design enhances optical performance and integration.
Career Highlights
Chen-Hua Douglas Yu has worked for prominent companies in the semiconductor sector, including Taiwan Semiconductor Manufacturing Company Limited and TSMC Solid State Lighting Limited. His dedication to innovation has solidified his reputation as a leading figure in the field.
Collaborations
Throughout his career, Yu has collaborated with several talented individuals, including Chung-Shi Liu and Hao-Yi Tsai. These partnerships have enriched his research and development efforts, leading to groundbreaking advancements in packaging technologies.
Conclusion
With his extensive patent portfolio and innovative approaches to semiconductor packaging, Chen-Hua Douglas Yu exemplifies the spirit of invention. His contributions have not only propelled his career but also significantly influenced the technology landscape, paving the way for future advancements in the industry.
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