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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12489089 B1

PDFFull Text
Date of Patent:
Dec. 02, 2025

Filed:

Nov. 09, 2023

Chip package structure with conductive shielding film

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chen-Hua Yu, Hsinchu, TW;

An-Jhih Su, Taoyuan, TW;

Jing-Cheng Lin, Hsinchu, TW;

Po-Hao Tsai, Taoyuan, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Matthew E Warren

Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/60 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/552 (2013.01); H01L 23/562 (2013.01); H01L 23/60 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 21/486 (2013.01); H01L 21/568 (2013.01); H01L 23/49805 (2013.01); H01L 23/5389 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/181 (2013.01);
Abstract

A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film has a concave upper surface facing the first ground bump.

Find Patent Forward Citations

Yu, Chen-Hua. (2025). Chip package structure with conductive shielding film (U.S. Patent No. 12489089). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12489089

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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