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Hsin-Chu, Taiwan

Taiwan Semiconductor Manufacturing Comp. Ltd.

USPTO Granted Patents = 40,739

CIPO Patents = 4

EPO Patents = 104

Trademarks = 39

Forward Citations = 247,590

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13,765 inventors (with patents filed for the assignee):

Chen-Hua Douglas Yu (1,926 out of 1,951 patents)

Chih-Hao Wang (880 out of 896 patents)

Hsien-Wei Chen (858 out of 858 patents)

4. Chung-Shi Liu (745 out of 746 patents)

5. Shin-Puu Jeng (647 out of 671 patents)

6. Dun-Nian Yaung (528 out of 529 patents)

7. Jing-Cheng Lin (491 out of 518 patents)

8. Chia-Shiung Tsai (484 out of 485 patents)

9. Jhon Jhy Liaw (463 out of 464 patents)

10. Ming-Fa Chen (426 out of 426 patents)

11. Hao-Yi Tsai (425 out of 425 patents)

12. Chih-Han Lin (417 out of 417 patents)

13. Ming-Da Cheng (399 out of 398 patents)

14. Sai-Hooi Yeong (399 out of 400 patents)

15. Che-Cheng Chang (382 out of 389 patents)

Core Competencies:

Semiconductor Devices

Photoresist Developer

Extreme Ultraviolet Lithography

Physical Vapor Deposition

Integrated Circuit Packages

Heterostructure Channel Layer

Chip Package Structure

Multigate Devices

Transistor Fabrication

Wet Etch Apparatus

Annealing Apparatus

Bubble Removal Techniques

40,739 patents: Sort by Forward Citations

1. 12501842 - Non-volatile memory device and manufacturing technology (2025-12-16),

2. 12501836 - Dual magnetic tunnel junction devices for magnetic random access memory (MRAM) (2025-12-16),

3. 12501732 - Pixel sensor including refraction structures (2025-12-16),

4. 12501722 - Image sensor with dummy polysilicon based extension pad (2025-12-16),

5. 12501713 - Revising IC layout design to eliminate gaps between isolation structures (2025-12-16),

6. 12501701 - Power rails for stacked semiconductor device (2025-12-16),

7. 12501700 - Integrated circuit, semiconductor device having stop segment in connection region between logic region and memory cell region (2025-12-16),

8. 12501697 - Methods of forming semiconductor devices (2025-12-16),

9. 12501696 - FinFET devices with dummy fins having multiple dielectric layers (2025-12-16),

10. 12501692 - Semiconductor device for a low-loss antenna switch (2025-12-16),

11. 12501691 - Semiconductor device for a low-loss antenna switch (2025-12-16),

12. 12501690 - Hardmask formation with hybrid materials in semiconductor device (2025-12-16),

13. 12501689 - Nanostructure field-effect transistor device and method of forming (2025-12-16),

14. 12501687 - Dual silicide layers in semiconductor devices (2025-12-16),

15. 12501679 - Interconnect structures for semiconductor devices and methods of manufacturing the same (2025-12-16),

Taiwan Semiconductor Manufacturing Company Limited (TSMC) is a global leader in semiconductor manufacturing. As the world's largest dedicated semiconductor foundry, TSMC provides advanced technology and manufacturing services for various semiconductor applications. TSMC operates leading-edge fabrication plants and offers a wide range of process technologies, including FinFET, high voltage, and mixed signal/RFCMOS. With a commitment to innovation and quality, TSMC enables its customers to bring their cutting-edge semiconductor designs to market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 16 2025

40,739 Patents

#1 in Hsin-Chu

#1 in Taiwan

#14 in the World

Hsin-Chu, Taiwan

Taiwan Semiconductor Manufacturing Comp. Ltd.

Forward Citations = 247,590

13,765 inventors:

Chen-Hua Douglas Yu (1,926 out of 1,951 patents)

Chih-Hao Wang (880 out of 896 patents)

Hsien-Wei Chen (858 out of 858 patents)

4. Chung-Shi Liu (745 out of 746 patents)

5. Shin-Puu Jeng (647 out of 671 patents)

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