The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Aug. 10, 2023
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chansyun David Yang, Shinchu, TW;

Keh-Jeng Chang, Hsinchu, TW;

Chan-Lon Yang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/01 (2025.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H10D 86/00 (2025.01);
U.S. Cl.
CPC ...
H10D 86/011 (2025.01); H01L 21/76256 (2013.01); H01L 21/76816 (2013.01); H01L 21/76898 (2013.01); H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); H10D 86/215 (2025.01);
Abstract

The present disclosure describes a method to form a stacked semiconductor device with power rails. The method includes forming the stacked semiconductor device on a first surface of a substrate. The stacked semiconductor device includes a first fin structure, an isolation structure on the first fin structure, and a second fin structure above the first fin structure and in contact with the isolation structure. The first fin structure includes a first source/drain (S/D) region, and the second fin structure includes a second S/D region. The method also includes etching a second surface of the substrate and a portion of the first S/D region or the second S/D region to form an opening. The second surface is opposite to the first surface. The method further includes forming a dielectric barrier in the opening and forming an S/D contact in the opening.


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