Ruilong Xie

Title: Ruilong Xie: A Pioneer in Microelectronic Structures

Introduction

Ruilong Xie is a prominent inventor based in Niskayuna, NY (US), known for his significant contributions to the field of microelectronics. With an impressive portfolio of 1,163 patents, he has made substantial advancements in interconnect structures and metal via technologies.

Latest Patents

Among his latest innovations, Xie has developed a "Wrap around metal via structure." This invention includes a first metal level with a first metal line and a second metal level that is spaced apart, featuring a second metal line. The first metal via structure connects these two lines, ensuring direct contact with both the sidewall and horizontal surfaces of the first metal line. Another notable patent is for "Interconnect structures with vias having vertical and horizontal sections." This microelectronic structure comprises a first interconnect line at one level and a second interconnect line at another level, connected by at least one via that includes both vertical and horizontal sections.

Career Highlights

Ruilong Xie has had a distinguished career, working with leading companies in the technology sector. He has been associated with International Business Machines Corporation (IBM) and Globalfoundries Inc., where he has contributed to groundbreaking research and development in microelectronics.

Collaborations

Throughout his career, Xie has collaborated with notable colleagues, including Kangguo Cheng and Chanro Park. These partnerships have fostered innovation and have been instrumental in advancing their shared goals in the field.

Conclusion

Ruilong Xie's work in microelectronic structures has significantly impacted the industry, showcasing his expertise and dedication to innovation. His numerous patents reflect his commitment to advancing technology and improving microelectronic designs.