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For the Inventor, By the Inventor

Coppell, TX, United States of America

Stmicroelectronics Gmbh


USPTO Granted Patents = 2,891

% Expired Patents = 11.5


Trademarks = 2

Forward Citations = 22,902

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1,458 inventors (with patents filed for the assignee):

goldMedal Qing Liu (159 out of 187 patents)

silverMedal John H Zhang (152 out of 219 patents)

bronzeMedal Nicolas J Loubet (125 out of 303 patents)

4.  David C McClure (93 out of 240 patents)

5.  Olivier Le Neel (66 out of 68 patents)

6.  George A Vlantis (65 out of 66 patents)

7.  Ruilong Xie (62 out of 1,415 patents)

8.  Chun-chen Yeh (55 out of 297 patents)

9.  Tsiu Chiu Chan (55 out of 106 patents)

10.  Pierre Morin (54 out of 70 patents)

11.  Jefferson Sismundo Talledo (54 out of 54 patents)

12.  Liwen Chu (53 out of 456 patents)

13.  Xiuyu Cai (51 out of 162 patents)

14.  Anthony M Chiu (51 out of 84 patents)

15.  Prasanna Khare (45 out of 49 patents)


Core Competencies:
MEMS Sensors
Wafer Level Packages
Multi-Chip Package
Optical Sensor
Low Profile Packages
Gas Sensor
3D Packaging
Die Embedded
Leadframe Design
Thermal Management
Inertial Navigation
Motion Detection

2,891 patents:

1. 12733516 - Semiconductor package with exposed electrical contacts (2026-09-08),
2. 12677122 - NFC device position finder (2026-07-07),
3. 12674850 - System and method for fast magnetometer calibration using gyroscope (2026-07-07),
4. 12666996 - Passivation layer for an integrated circuit device that provides a moisture and proton barrier (2026-06-23),
5. 12665385 - Optical integrated circuit sensor package using a stacked configuration for the sensor die and the emitter die (2026-06-23),
6. 12638590 - Method and device of distance measurement by time-of-flight calculation with wraparound (2026-05-26),
7. 12637349 - Wafer level chip scale packaging with sensor (2026-05-26),
8. 12635557 - Sensor package including a sensor die (2026-05-19),
9. 12602949 - System and method for detecting human presence based on depth sensing and inertial measurement (2026-04-14),
10. 12591815 - Method and system for updating machine learning based classifiers for reconfigurable sensors (2026-03-31),
11. 12561577 - Automatic filter selection in decision tree for machine learning core (2026-02-24),
12. 12557694 - Semiconductor package with gas release holes (2026-02-17),
13. 12556487 - Method, system, and circuits for RF low-latency, multiple priority communication (2026-02-17),
14. 12554363 - System and method for display synchronization (2026-02-17),
15. 12554016 - Method of detecting presense of an object using a time of flight sensor (2026-02-17),
STMicroelectronics GmbH, based in Coppell, TX, specializes in semiconductor packaging solutions, focusing on advanced technologies such as MEMS sensors and optical sensors. The company is known for its innovative approaches to wafer level packages, multi-chip packages, and low profile packages, catering to diverse applications including automotive and industrial sectors. With a strong emphasis on 3D packaging and die embedded technologies, STMicroelectronics continues to drive advancements in the semiconductor industry, enhancing performance and efficiency.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Stmicroelectronics Gmbh
2,891 Patents

#1 in Coppell, TX

#15 in Texas

#161 in US

#326 in the World

Coppell, TX (US)
Coppell, TX, United States of America

Stmicroelectronics Gmbh

Forward Citations = 22,902

1,458 inventors:

goldMedal Qing Liu (159 out of 187 patents)

silverMedal John H Zhang (152 out of 219 patents)

bronzeMedal Nicolas J Loubet (125 out of 303 patents)

4.  David C McClure (93 out of 240 patents)

5.  Olivier Le Neel (66 out of 68 patents)

Please report any incorrect information to [email protected]
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