Jefferson Sismundo Talledo

This inventor holds 54 USPTO granted patents and 10 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging. Top assignees: Stmicroelectronics Gmbh, Stmicroelectronics S.r.l.. Active years: 2015-2025.

USPTO Granted Patents = 54 (Patent Applications = 10)

% Patents Active = 98.1

EPO Patents = 4 (Patent Applications = 7)

Average Co-Inventor Count = 1.5

ph-index = 4

Forward Citations = 54(Granted Patents)

Forward Citations (Not Self Cited) = 50(Dec 10, 2025)

Location History:

Laguna, PH (2015 - 2018)
Calambra, PH (2021)
Calamba, PH (2017 - 2024)

Company Filing History:

54 out of 2,891

Stmicroelectronics Gmbh

patents

2 out of 5,689

Stmicroelectronics S.r.l.

patents

where one patent can have more than one assignee

Years Active: 2015-2025

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Areas of Expertise:

Leadframe

Semiconductor Package

Micro-Electromechanical System

Cooling Fins

Adhesive Fillets

Stress Buffer

Flexible Interconnect

Die Embedded

Tapeless Design

Solder Balls

Manufacturing Method

ESD Protection

54 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12494442 - Leadframe with varying thicknesses and method of manufacturing semiconductor packages (2025-12-09),

2. 12421108 - Capless semiconductor package with a micro-electromechanical system (mems) (2025-09-23),

3. 12211772 - Method of manufacturing semiconductor devices and corresponding semiconductor device (2025-01-28),

4. 12170240 - Lead frame for improving adhesive fillets on semiconductor die corners (2024-12-17),

5. 12094725 - Leadframe package with pre-applied filler material (2024-09-17),

6. 12080657 - Die embedded in substrate with stress buffer (2024-09-03),

7. 11948868 - Compact leadframe package (2024-04-02),

8. 11897763 - Capless semiconductor package with a micro-electromechanical system (MEMS) (2024-02-13),

9. 11848256 - Semiconductor package having die pad with cooling fins (2023-12-19),

10. 11715677 - Semiconductor device with frame having arms (2023-08-01),

11. 11699667 - Leadframe with pad anchoring members and method of forming the same (2023-07-11),

12. 11664239 - Lead frame for improving adhesive fillets on semiconductor die corners (2023-05-30),

13. 11658098 - Leadframe package with side solder ball contact and method of manufacturing (2023-05-23),

14. 11610851 - Die embedded in substrate with stress buffer (2023-03-21),

15. 11552007 - Modified leadframe design with adhesive overflow recesses (2023-01-10),

Title: The Innovative Mind of Jefferson Sismundo Talledo

Introduction:

Jefferson Sismundo Talledo is a visionary inventor hailing from Calamba, Philippines. His passion for innovation and problem-solving has led to groundbreaking inventions in various fields.

Latest Patents:

Jefferson Sismundo Talledo holds several patents in the areas of renewable energy technologies, sustainable agriculture solutions, and advanced medical devices. His commitment to creating a positive impact on society is evident in his recent patent applications.

Career Highlights:

With a background in engineering and a keen interest in research and development, Jefferson Sismundo Talledo has had a successful career marked by numerous achievements. His ability to translate ideas into tangible inventions has garnered recognition in the industry.

Collaborations:

Throughout his career, Jefferson Sismundo Talledo has collaborated with leading experts in diverse fields to bring his inventions to life. His collaborative spirit and innovative approach have resulted in successful partnerships that have pushed the boundaries of technological advancement.

Conclusion:

Jefferson Sismundo Talledo's dedication to innovation and his relentless pursuit of excellence make him a prominent figure in the world of inventors. His contributions have not only transformed industries but have also inspired the next generation of inventors to think creatively and ambitiously.