The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2024
Filed:
Apr. 19, 2023
Applicant:
Stmicroelectronics, Inc., Calamba, PH;
Inventors:
Rennier Rodriguez, Bulacan, PH;
Maiden Grace Maming, Calamba, PH;
Jefferson Sismundo Talledo, Calamba, PH;
Assignee:
STMicroelectronics, Inc., Calamba, PH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 21/4825 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/562 (2013.01); H01L 24/29 (2013.01);
Abstract
The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.