The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2026

Filed:

Jul. 26, 2022
Applicant:

Stmicroelectronics Pte Ltd, Singapore, SG;

Inventor:

Jing-En Luan, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H10F 39/00 (2025.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 74/129 (2026.01); H10F 39/024 (2025.01); H10F 39/026 (2025.01); H10W 74/124 (2026.01);
Abstract

The present disclosure is directed to embodiments of sensor package including a doped resin on respective surfaces and sidewalls of a transparent portion, a sensor die, and a support structure extending from the transparent portion to the sensor die. The support structure suspends the transparent portion over a sensor of the sensor die. The doped resin is doped with an additive material, and the additive material is activated by exposing the doped resin to a laser. The doped resin is exposed to the laser forming conductive layers extending along the doped resin for providing electrical connections within the sensor package and to electronic components external to the embodiments of the sensor die packages. The conductive layers are at least partially covered by a non-conductive layer.


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Luan, Jing-En. (2026). Sensor package including a sensor die (U.S. Patent No. 12635557). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12635557

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