The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
May. 23, 2022
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chen-Hua Yu, Hsinchu, TW;
Ying-Jui Huang, Zhubei, TW;
Chih-Hang Tung, Hsinchu, TW;
Tung-Liang Shao, Hsinchu, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chien Ling Hwang, Hsinchu, TW;
Yi-Li Hsiao, Hsinchu, TW;
Su-Chun Yang, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/4853 (2013.01); H01L 21/4864 (2013.01); H01L 24/75 (2013.01); H01L 25/50 (2013.01); H01L 21/6838 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/757 (2013.01); H01L 2224/81013 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/81091 (2013.01); H01L 2224/812 (2013.01); H01L 2224/81908 (2013.01);
Abstract
A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.