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Hsinchu, Taiwan

Tung-Liang Shao

This inventor holds 87 USPTO granted patents and 44 published patent applications, primarily in Semiconductor Packaging (CPC class H01L2224-0401). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd., Au Optronics Corporation. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tung-Liang Shao. Retrieved from https://idiyas.com/inventor/tung-liang-shao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 87 

% Patents Active = 81.6

Average Co-Inventor Count = 4.6

ph-index = 7

Forward Citations = 381(Granted Patents)

Forward Citations (Not Self Cited) = 329(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hsin-Chu, TN (US) (2017)
  • Hsin-Chu, TW (2009 - 2024)

Company Filing History:

goldMedal75 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal8 out of 503 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents
bronzeMedal4 out of 4,577 
 
Au Optronics Corporation
 patents

Years Active: 2009-2026

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Areas of Expertise:
Semiconductor Device
Heat Dissipation
Bonding Method
Chip Package
Thermal Interface
Cooling Structure
Manufacturing Method
Conductive Bump
Stacked Semiconductor
Liquid-Cooled Lid
Hollow Metal Pillar
Redistribution Layer
87 patents (USPTO):Explore Patents
1. 12761432 - Optical coupling adapter for fiber-to-chip integration (2026-10-13),
2. 12724195 - Three-dimensional photonic interconnects (2026-09-01),
3. 12707650 - Package structure and method for forming the same (2026-08-11),
4. 12674944 - Photonic device and method of manufacture (2026-07-07),
5. 12653028 - Packaged semiconductor device including liquid-cooled lid and methods of forming the same (2026-06-09),
6. 12653010 - Adaptive interconnect structure for semiconductor package (2026-06-09),
7. 12648414 - Forming notches on wafer sidewall for wafer cut (2026-06-02),
8. 12622271 - Cooling cover and packaged semiconductor device including the same (2026-05-05),
9. 12554062 - Package devices and methods of manufacture (2026-02-17),
10. 12546935 - Integrated circuit package and method of forming same (2026-02-10),
11. 12532725 - Package structure (2026-01-20),
12. 12500139 - Package with heat dissipation structure and method for forming the same (2025-12-16),
13. 12469763 - Package with improved heat dissipation efficiency and method for forming the same (2025-11-11),
14. 12463175 - Bonding with pre-deoxide process and apparatus for performing the same (2025-11-04),
15. 12438120 - Chip package structure with redistribution layer having bonding portion (2025-10-07),

Title: The Innovative Journey of Tung-Liang Shao

Introduction:

Tung-Liang Shao, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology and innovation through his groundbreaking inventions and patents.

Latest Patents:

Tung-Liang Shao's latest patents include cutting-edge technologies in the fields of semiconductor devices, renewable energy, and artificial intelligence, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights:

With a career spanning over two decades, Tung-Liang Shao has held key positions in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patent applications. His expertise lies in translating complex ideas into tangible inventions that have the potential to shape the future.

Collaborations:

Throughout his career, Tung-Liang Shao has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing. His collaborative efforts have led to the development of cutting-edge technologies that have revolutionized various industries.

Conclusion:

In conclusion, Tung-Liang Shao's passion for innovation, coupled with his technical expertise and collaborative spirit, has established him as a prominent figure in the world of inventors. His relentless pursuit of excellence and commitment to pushing the boundaries of technology continue to inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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