The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

May. 25, 2023
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tung-Liang Shao, Hsinchu, TW;

Yu-Sheng Huang, Hemei Township, TW;

Chen-Hua Yu, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/255 (2006.01); G02B 6/122 (2006.01); G02B 6/13 (2006.01); G02B 6/42 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/1228 (2013.01); G02B 6/13 (2013.01); G02B 6/2551 (2013.01); G02B 6/4202 (2013.01); G02B 2006/12121 (2013.01);
Abstract

A device is provided that includes: a photonic integrated circuit; a laser die comprising a welding pad; and a first optical fiber including: a first end of the first optical fiber fused to a surface of the photonic integrated circuit, wherein a first fusion bond exists between the first end of the first optical fiber and the surface of the photonic integrated circuit; and a second end of the first optical fiber fused to the welding pad, wherein a second fusion bond exists between the second end of the first optical cable and the welding pad.


Find Patent Forward Citations

Quick Actions:

Shao, Tung-Liang. (2026). Package devices and methods of manufacture (U.S. Patent No. 12554062). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12554062

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…