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For the Inventor, By the Inventor

Zhunan, Taiwan

Yu-Chia Lai

USPTO Granted Patents = 70 

Average Co-Inventor Count = 6.5

ph-index = 4

Forward Citations = 117(Granted Patents)

Forward Citations (Not Self Cited) = 105(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Zhunan Township, Miaoli County, TW (2015)
  • Miaoli, TW (2019)
  • Hsinchu, TW (2023)
  • Zhunan Township, TW (2015 - 2024)
  • Miaoli County, TW (2016 - 2024)

Company Filing History:

goldMedal70 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2025

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70 patents (USPTO):
1. 12406961 - Integrated circuit package and method (2025-09-02),
2. 12374592 - Semiconductor device and manufacturing method thereof (2025-07-29),
3. 12368141 - IPD modules with flexible connection scheme in packaging (2025-07-22),
4. 12300618 - Semiconductor device having a heat dissipation structure connected chip package (2025-05-13),
5. 12300571 - Integrated circuit package and method (2025-05-13),
6. 12278208 - Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer (2025-04-14),
7. 12278199 - Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications (2025-04-14),
8. 12205923 - Semiconductor device, circuit board structure and manufacturing method thereof (2025-01-21),
9. 12166015 - Semiconductor package and manufacturing method of semiconductor package (2024-12-10),
10. 12100682 - Package structure with conductive patterns in a redistribution layer (2024-09-24),
11. 12057405 - Packages with thick RDLs and thin RDLs stacked alternatingly (2024-08-06),
12. 12014976 - Chip package structure including a silicon substrate interposer and methods for forming the same (2024-06-18),
13. 11990381 - Integrated circuit packages having support rings (2024-05-21),
14. 11942451 - Semiconductor structure and method of forming the same (2024-03-26),
15. 11848319 - Multi-chip semiconductor package (2023-12-19),

Title: The Innovative Journey of Inventor Yu-Chia Lai

Introduction: Yu-Chia Lai, a talented inventor hailing from Zhunan, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Yu-Chia Lai holds several patents in the areas of electronics and telecommunications, with his most recent patent focusing on a cutting-edge communication device that revolutionizes the way we connect with one another.

Career Highlights: Throughout his illustrious career, Yu-Chia Lai has been recognized for his innovative spirit and dedication to pushing the boundaries of technological advancement. His work has not only earned him numerous accolades but has also improved the lives of many through his inventive solutions.

Collaborations: Yu-Chia Lai has collaborated with leading tech companies and research institutions to further develop his inventions and bring them to the market. His ability to work seamlessly with others in the industry has led to the successful implementation of his groundbreaking ideas.

Conclusion: In conclusion, Yu-Chia Lai stands as a beacon of innovation in the world of technology, with his inventive prowess and forward-thinking mindset shaping the future of electronics and telecommunications. His contributions continue to inspire aspiring inventors and pave the way for a more connected and technologically advanced society.

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