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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12368141 B1

PDFFull Text
Date of Patent:
Jul. 22, 2025

Filed:

Jul. 24, 2023

Ipd modules with flexible connection scheme in packaging

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yu-Chia Lai, Zhunan Township, TW;

Cheng-Chieh Hsieh, Tainan, TW;

Tin-Hao Kuo, Hsinchu, TW;

Hao-Yi Tsai, Hsinchu, TW;

Chung-Shi Liu, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 23/4012 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 25/50 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/73209 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract

A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.

Find Patent Forward Citations

Lai, Yu-Chia. (2025). Ipd modules with flexible connection scheme in packaging (U.S. Patent No. 12368141). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12368141

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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