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For the Inventor, By the Inventor

Tainan, Taiwan

Cheng-Chieh Hsieh

This inventor holds 90 USPTO granted patents and 29 published patent applications, primarily in Semiconductor Packaging (CPC class H01L24-16). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2013-2026.

USPTO Granted Patents = 90 

% Patents Active = 88.9

Average Co-Inventor Count = 5.2

ph-index = 8

Forward Citations = 286(Granted Patents)

Forward Citations (Not Self Cited) = 258(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Yongkang, TW (2013 - 2015)
  • Yongkang District, TW (2014 - 2018)
  • Tainan County, TW (2016 - 2021)
  • Tainan, TW (2016 - 2024)

Company Filing History:

goldMedal89 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2013-2026

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Areas of Expertise:
Heat Dissipation
Photonic Integrated Circuit
Semiconductor Structure
Flexible Connection
Die Stacking
Optical Interconnect
IPD Modules
Manufacturing Method
Package Structure
Semiconductor Device
Thermal Management
Contact Pad
90 patents (USPTO):Explore Patents
1. 12543569 - Package with improved heat dissipation efficiency and method for forming the same (2026-02-03),
2. 12442995 - Photonic integrated circuit and package structure (2025-10-14),
3. 12374627 - Method of fabricating semiconductor structure (2025-07-29),
4. 12368141 - IPD modules with flexible connection scheme in packaging (2025-07-22),
5. 12362329 - Method of fabricating semiconductor package (2025-07-15),
6. 12362283 - Semiconductor device and method of manufacturing the same (2025-07-15),
7. 12360321 - Package structure, semiconductor device and method of fabricating the same (2025-07-15),
8. 12315784 - Semiconductor package and manufacturing method thereof (2025-05-27),
9. 12266639 - Method of fabricating semiconductor package (2025-04-01),
10. 12222545 - Package and method of forming same (2025-02-11),
11. 12210200 - Photonic semiconductor device and method of manufacture (2025-01-28),
12. 12210188 - Semiconductor package and manufacturing method thereof (2025-01-28),
13. 12176282 - Manufacturing method of semiconductor package (2024-12-24),
14. 12164158 - Package having prism structure and manufacturing method thereof (2024-12-10),
15. 12132024 - Semiconductor package and method of manufacturing the same (2024-10-29),

Title: The Innovative Journey of Cheng-Chieh Hsieh

Introduction: Cheng-Chieh Hsieh, a talented inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Cheng-Chieh Hsieh's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Cheng-Chieh Hsieh has established himself as a leading figure in the tech industry. His innovative solutions have garnered international recognition, earning him prestigious awards for his contributions to sustainable energy and environmental conservation.

Collaborations: Throughout his career, Cheng-Chieh Hsieh has collaborated with top research institutions and leading tech companies to further his inventions. His partnerships have led to the successful implementation of his ideas on a global scale, impacting industries far and wide.

Conclusion: Cheng-Chieh Hsieh's relentless pursuit of innovation and his passion for creating a more sustainable future have solidified his position as a trailblazer in the world of technology. His inventions continue to inspire and shape the landscape of renewable energy, leaving a lasting impact for generations to come.

Profile summary based on public USPTO records.
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