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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12222545 B1

PDFFull Text
Date of Patent:
Feb. 11, 2025

Filed:

Apr. 18, 2023

Package and method of forming same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chih-Hsuan Tai, Taipei, TW;

Chung-Ming Weng, Hsinchu, TW;

Hung-Yi Kuo, Taipei, TW;

Cheng-Chieh Hsieh, Tainan, TW;

Hao-Yi Tsai, Hsinchu, TW;

Chung-Shi Liu, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Michelle R Connelly

Int. Cl.
CPC ...
G02B 6/13 (2006.01); G02B 6/12 (2006.01); G02B 6/30 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
G02B 6/13 (2013.01); G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); G02B 6/30 (2013.01); G02B 6/4214 (2013.01); G02B 6/424 (2013.01); G02B 6/4249 (2013.01); G02B 6/43 (2013.01); H01L 21/56 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/167 (2013.01); G02B 2006/12147 (2013.01); G02B 6/4232 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/214 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01);
Abstract

An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

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